package dimension agilent hlmp-ld15, hlmp-lm15, hlmp-lb15 4mm precision optical performance red, green and blue standard oval leds data sheet features ? ? ? ? ? well defined spatial radiation pattern ? ? ? ? ? high brightness material ? ? ? ? ? available in red, green and blue color. red alingap 630mm green ingan 525nm blue ingan 470nm ? ? ? ? ? superior resistance to moisture benefits ? ? ? ? ? viewing angle designed for wide filed of view applications ? ? ? ? ? superior performance for outdoor environments applications ? ? ? ? ? full color signs ? ? ? ? ? commercial outdoor advertising. description these precision optical performance oval leds are specifically designed for full color/video and passenger information signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. these lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. high efficiency led material is used in these lamps: aluminum indium gallium phosphide (alingap ii) for red and indium gallium nitride for blue and green. each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. the package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long-term exposure to direct sunlight. notes: 1. dimension in millimeters (inches). caution: ingan devices are class i esd sensitive. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. 6.3?.2 0.248?.008 9.65?.2 0.380?.008 3.7?.2 0.146?.008 1.25?.2 0.049?.008 21.0 0.827 min. max. epoxy meniscus cathode lead min. 1.0 0.038 2.9?.2 0.114?.008 0.4?.1 0.016?.004 2.54?.3 0.100?.012 0.45?.10 0.018?.004 0.8 0.016
2 device selection guide part numbering system notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package 2. the tolerance for intensity limit is 15% 3. the optical axis is closely aligned with the package mechanical axis 4. the dominant wavelength, d , is derived from the chromaticity diagram and represents the color of the lamp. part number color and dominant wavelength d (nm) typ . luminous intensity iv (mcd) at 20 ma tinting type min. max hlmp-ld15-nrtxx red 630 680 1900 red hlmp-lm15-qt0xx green 525 1150 3200 green hlmp-lb15-kn0xx blue 470 310 880 blue mechanical option 00: bulk zz: flexi-bin, ammo pack color bin options 0: no color bin limitation t: red color with max v f of 2.6v maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide color b: 470nm blue m: 525nm green d: 630nm red package l: 4mm standard oval h l m p - -15xxxxx l x
3 notes: 1. refer to vf bin table. 2. the radiant intensity, i e in watts per steradian, may be found from the equation i e = i v / v where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. absolute maximum rating t a = 25 o c electrical/optical characteristics notes: 1. derate linearly as shown in figure 4 and figure 8. 2. duty factor 30%, frequency 1khz. 3. duty factor 10%, frequency 1khz. parameter red blue and green unit dc forward current [1] 50 30 ma peak forward current 100 [2] 100 [3] ma power dissipation 120 130 mw reverse voltage 5 (i r = 100 a) 5 (i r = 10 a) v led junction temperature 130 130 o c operating temperature range -40 to +100 -40 to +80 o c storage temperature range -40 to +120 -40 to +100 o c parameter symbol min. typ. max. units test condition forward voltage red ( d = 630nm) [1] blue ( d = 470nm) green ( d = 525nm) v f 2.3 3.8 3.8 2.6 4.0 4.0 vi f = 20 ma reverse voltage red ( d = 630nm) blue ( d = 470nm) green ( d = 525nm) v r 5v i r = 100 a i r = 10 a i r = 10 a peak wavelength red ( d = 630nm) blue ( d = 470nm) green ( d = 525nm) peak 639 467 520 nm peak of wavelength of spectral distribution at i f = 20 ma spectral half width red ( d = 630nm) blue ( d = 470nm) green ( d = 525nm) ? 1/2 17 24 35 nm wavelength width at spectral distribution power point at i f = 20 ma capacitance red ( d = 630nm) blue ( d = 470nm) green ( d = 525nm) c 40 43 43 pf v f = 0, f = 1 mhz thermal resistance r j-pin 240 o c/w led junction to cathode lead luminous efficacy [2] red ( d = 630nm) blue ( d = 470nm) green ( d = 525nm) v 155 75 520 lm/w emitted luminous power/emitted radiant power
4 alingap red 630nm figure 1. relative intensity vs. wavelength figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward current figure 4. forward current vs. ambient temperature wavelength ? nm relative intensity 1.0 0.5 0 600 700 500 650 550 dc forward current - ma 0 0 forward voltage - v 2.5 40 30 0.5 1.5 60 3.0 10 20 50 1.0 2.0 relative intensity (normalized at 20 ma) 0 0 forward current - ma 40 2.0 1.5 1.0 0.5 20 50 2.5 10 30 i f - forward current - ma 0 0 t a - ambient temperature - c 40 80 50 40 30 20 10 20 60 100 r ja = 780 ?c/w r ja = 585 ?c/w
5 ingan blue and green figure 5. relative intensity vs. wavelength figure 6. forward current vs. forward voltage. figure 7. relative luminous intensity vs. forward current. figure 8. forward current vs. ambient temperature. figure 9. relative dominant wavelength vs. forward current wavelength - nm relative luminous intensity 1.0 0.2 0 600 700 400 650 550 500 450 0.4 0.6 0.8 blue green 0 25 10 forward current - ma forward voltage - v 0 5.0 1.5 2.0 2.5 5 15 30 1.0 0.5 20 3.0 3.5 4.0 4.5 relative luminous intensity (normalized at 20 ma) 0 0 forward current - ma 15 25 1.2 0.6 30 0.2 0.8 1.4 20 5 1.0 0.4 10 maximum forward current - ma 0 0 30 60 25 20 15 10 5 10 50 80 35 90 20 40 70 30 ambient temperature - ?c r ja = 780 ?c/w r ja = 585 ?c/w 0.985 1.025 1.000 relative dominant wavelength forward current - ma 0 0.990 1.010 1.035 1.015 51015 20 25 30 0.995 1.005 1.020 1.030 green blue
6 intensity bin limit table tolerance for each bin limit is 0.05v. vf bin table [2] (v at 20ma) tolerance for each bin limit is 15% bin intensity (mcd) at 20 ma min max k 310 400 l400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 bin id min. max. va 2.0 2.2 vb 2.2 2.4 vc 2.4 2.6 figure 10a. spatial radiation pattern ?major axis for rbg figure 10b. spatial radiation pattern ?minor axis for rgb 0 0.5 1 -90 -60 -30 0 30 60 90 angular displacement - degree relative intensity 0 0.5 1 -90 -60 -30 0 30 60 90 angular displacement - degree relative intensity
7 note: 1. all bin categories are established for classification of products. products may not be available in all bin categories. please contact your agilent representative for further information. 2. vf bin table only available for those alingap red devices with options ?xxtxx. tolerance for each bin limit is 0.5nm tolerance for each bin limit is 0.5 nm tolerance for each bin limit is 0.5 nm blue color bin table green color bin table red color range bin min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 bin min dom max dom xmin ymin xmax ymax 622 634 0.6904 0.3094 0.6945 0.2888 0.6726 0.3106 0.7135 0.2865
wave soldering manual solder dipping pre-heat temperature 105 c max. ? preheat time 30 sec max ? peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max bottom side of pc board top side of pc board note: allow for boards to be sufficiently cooled before exerting mechanical force. conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma 250 200 150 fluxing turbulent wave preheat time - seconds temperature - ?c 100 50 30 0 10 20 30 40 50 60 70 80 90 100 laminar wave hot air knife led component ead size diagonal plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. ? recommended soldering condition: recommended wave soldering profile note: refer to application note an1027 for more information on soldering led components. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through holes size for led component leads.
www.agilent.com/ semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/inter- national), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2005 agilent technologies, inc. october 27, 2005 obsoletes 5989-1697en 5989-4142en
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